| Product Name | Diameter (in) | Type | Specific Resistance (Ω·cm) |
|---|---|---|---|
| ① CZ, MCZ Lapped Wafer | 3～8 | N＆P | 1～300 |
| ② FZ Wafer (NTD) | 3～6 | N＆P | 30～800 |
| ③ Si Epi Wafer | 4～8 | N＆P | Blanket：0.03～200、Buried Layer：0.5～200 |
| ④ SiC, GaN Epi Wafer | 4～6 | N＆P | |
| ⑤Foundry Service | Power IC / Discrete (5–6 in), SiC (4 in), GaN (6 in), etc. | ||
